Evaluation Of Diode Laseer-Aided Debonding Of Two Different Types Of Ceramic Brakets (An In Vitro Study)

Document Type : Original Article

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Orthodontic Department, Faculty of Dentistry, Alexandria University, Alexandria, Egypt

Abstract

Objective: To evaluate and compare the shear bond strength (SBS), enamel damage, and the Adhesive Remnant Index (ARI) following diode laser-aided debonding of monocrystalline and polycrystalline ceramic brackets. Materials and Methods: Forty extracted premolars were examined under a stereomicroscope and the frequency and lengths of enamel cracks present were recorded. The teeth were then randomly and equally allocated to one of the four groups: monocrystalline control (Group MC), monocrystalline laser (Group ML), polycrystalline control (Group PC), and polycrystalline laser (Group PL). A monocrystalline or polycrystalline bracket was bonded to each tooth according to the assigned group. These brackets were then debonded using a universal testing machine. In Groups ML and PL, a diode laser was applied to the teeth for 20 seconds before debonding. The SBS of each bracket was recorded. Following debonding, the ARI and the frequency and lengths of enamel cracks were examined using a stereomicroscope and recorded. Results: SBS values of Group MC (33.22 ± 3.99MPa) and Group PC (39.97 ± 7.61MPa) were significantly higher than those of Group ML (19.92 ± 3.53MPa) and Group PL (18.63 ± 4.16MPa) respectively (p < 0.001). The frequency and lengths of enamel cracks at the end of the experiment were significantly higher in Group MC and Group PC when compared to Group ML and Group PL respectively. ARI scores were not significantly different among the groups. Conclusion: Diode laser-aided debonding can significantly lower shear bond strengths of both monocrystalline and polycrystalline brackets resulting in significantly less enamel damage during debonding.

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